Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice

ABSTRACT

An optical element includes a base material, a liquid-repellent member provided on at least a part of a surface of the base material, and a light-reducing member provided between the base material and the liquid-repellent member to protect the liquid-repellent member from radiation of light by reducing the light. The optical element is usable for a liquid immersion exposure apparatus for exposing a substrate through a liquid. It is possible to avoid any inflow of the liquid in a liquid immersion area into an unexpected place via the optical element.

This nonprovisional application claims the benefit of U.S. ProvisionalApplication No. 60/772,878, filed Feb. 14, 2006, Japanese PatentApplication No. 2005-250556, filed Aug. 31, 2005, and Japanese PatentApplication No. 2006-026516, filed Feb. 3, 2006, the disclosures ofwhich are incorporated herein by reference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an exposure apparatus in which a liquidimmersion area is formed in an optical path space disposed on a side ofa substrate, an optical element which is usable for the exposureapparatus, an optical system which includes the optical element, anexposure method which is based on the use of the exposure apparatus, anda method for producing a microdevice based on the use of the exposureapparatus.

2. Description of the Related Art

Those having been hitherto suggested as the exposure apparatus of thistype include, for example, an exposure apparatus described inInternational Publication No. 99/49504. The exposure apparatus of thispatent document is provided with an illumination optical system whichirradiates a mask such as a photomask or a reticle with an exposurelight beam radiated from an exposure light source, and a projectionoptical system which projects an exposure pattern formed on the maskonto a substrate such as a glass plate or a wafer coated with aphotosensitive material (resist). The illumination optical system andthe projection optical system have barrels respectively. At least oneoptical element (for example, a lens) is accommodated in each of thebarrels.

In the case of the exposure apparatus described in InternationalPublication No. 99/49504, a liquid (pure water), which has a refractiveindex higher than that of the gas, is supplied to the optical path spaceas the space formed between the projection optical system and thesubstrate to form a liquid immersion area in order to respond to theadvance of the high density of the device and the advance of the finepattern to be formed on the substrate. Therefore, the exposure lightbeam, which is allowed to pass through the projection optical system, isradiated onto the substrate after passing through the liquid immersionarea.

In the case of the exposure apparatus described in InternationalPublication No. 99/49504, the surface of the optical element arranged onthe side nearest to the substrate in the projection optical system,which is opposed to the substrate, makes contact with the liquid.Therefore, for example, if a large amount of the liquid is unexpectedlysupplied, for example, by a liquid supply control mechanism, thefollowing possibility arises. That is, a part of the liquid disposed inthe liquid immersion area may travel along the side surface of theoptical element to make inflow into the barrel after passing through thegap between the optical element and a holder (holding member) forholding the optical element on the barrel. It is demanded that theoptical element, which is used under the severe condition of the liquidimmersion exposure, maintains appropriate characteristics for a longperiod of time.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a novel optical elementwhich is usable for a liquid immersion exposure apparatus and the liquidimmersion exposure apparatus which is provided with the same, as well asan exposure method and a method for producing a microdevice based on theuse of the liquid immersion exposure apparatus.

According to a first aspect of the present invention, there is providedan exposure apparatus which radiates an exposure beam onto a substrate:including an optical element which is irradiated with the exposure beamand of which an optical path space on an outgoing surface side of theoptical element for the exposure beam is filled with a liquid; whereinthe optical element includes a liquid-repellent functional film providedon at least a part of a surface of the optical element, which is locatedoutside an effective area of the optical element.

According to this exposure apparatus, the liquid-repellent functionalfilm makes it possible to avoid the adhesion of the liquid to anyportion disposed outside the effective area of the optical element.

According to a second aspect of the present invention, there is providedan exposure apparatus which exposes a pattern formed on a mask on asubstrate; including a projection optical system which has a pluralityof optical elements and which projects the pattern onto the substrate ina state that a liquid immersion area is formed in an optical path spaceon a side of a light-outgoing surface of an optical element arrangednearest to the substrate among the optical elements; and alight-shielding film and a liquid-repellent film provided on a part of asurface which is located outside an effective area of at least oneoptical element of the plurality of optical elements.

According to the exposure apparatus of the second aspect, it is possibleto avoid the adhesion of the liquid to any portion disposed outside theeffective area of the optical element. Further, the light-shielding filmmakes it possible to avoid the radiation of the light onto theliquid-repellent film.

According to a third aspect of the present invention, there is provideda method for producing a microdevice; including an exposure step forexposing a predetermined pattern on a substrate by using the exposureapparatus as defined in the first aspect; and a development step fordeveloping the substrate exposed in the exposure step. According to thismethod for producing the microdevice, it is possible to produce themicrodevice satisfactorily for a long period of time.

According to a fourth aspect of the present invention, there is provideda method for producing a microdevice; including an exposure step forexposing a predetermined pattern on a substrate by using the exposureapparatus as defined in the second aspect; and a development step fordeveloping the substrate exposed in the exposure step. According to thismethod for producing the microdevice, it is possible to produce themicrodevice satisfactorily for a long period of time.

According to a fifth aspect of the present invention, there is providedan optical element which is used for a liquid immersion exposureapparatus; including a base material; a liquid-repellent member which isprovided to cover at least a part of the base material; and alight-reducing member which is provided between the base material andthe liquid-repellent member. According to this optical element, it ispossible to avoid any unintended adhesion of the liquid to a part of thesurface of the optical element to be used for the liquid immersionexposure apparatus. Further, the radiation of light onto theliquid-repellent member can be reduced by providing the light-reducingmember between the liquid-repellent member and the base material of theoptical element.

According to a sixth aspect of the present invention, there is providedan optical system which is used for a liquid immersion exposureapparatus; including the optical element provided with a base material;a liquid-repellent member which is provided to cover at least a part ofthe base material; and a light-reducing member which is provided betweenthe base material and the liquid-repellent member. When the opticalsystem is used in the liquid immersion exposure apparatus, it ispossible to avoid any unintended adhesion of the liquid to the opticalelement of the optical system to be used for the exposure apparatus.

According to a seventh aspect of the present invention, there isprovided a liquid immersion exposure apparatus for exposing a substratevia a liquid; including an optical element provided with a basematerial; a liquid-repellent member which is provided to cover at leasta part of the base material; and a light-reducing member which isprovided between the base material and the liquid-repellent member.According to this exposure apparatus, it is possible to avoid anyunintended adhesion of the liquid to the optical element even when theliquid is used during the exposure.

According to an eighth aspect of the present invention, there isprovided a liquid immersion exposure method including providing asubstrate; and exposing the substrate via the optical element as definedin the fifth aspect. According to this exposure method, it is possibleto continue the satisfactory exposure for a long period of time.

According to a ninth aspect of the present invention, there is provideda method for producing a microdevice, including exposing the substrateby the exposure method as defined in the eighth aspect; developing theexposed substrate; and processing the developed substrate. According tothe method for producing the microdevice, it is possible to continue theproduction of the satisfactory microdevice.

According to a tenth aspect of the present invention, there is provideda method for producing an optical element which is used for a liquidimmersion exposure apparatus; the method including providing aliquid-repellent member to cover at least a part of a base material; andproviding a light-reducing member which protects the liquid-repellentmember between the base material and the liquid-repellent member.According to this production method, it is possible to produce theoptical element as defined in the fifth aspect.

According to an eleventh aspect of the present invention, there isprovided a method for producing a liquid immersion exposure apparatus;the method including providing the optical element produced by theproduction method as defined in the tenth aspect; a step for providingan illumination optical system; a step for providing a projectionoptical system including the optical element provided at a predeterminedposition in a barrel; a step for providing a stage for carrying asubstrate thereon; a step for providing a liquid supply system whichsupplies a liquid to a space between the projection optical system andthe substrate; and an adjusting step for adjusting arrangement of theillumination optical system, the projection optical system, and thestage so that a light beam, which is emitted from a light source, istransmitted via the illumination optical system and the projectionoptical system in this order to arrive at the substrate. According tothis method, it is possible to produce the liquid immersion exposureapparatus as defined in the seventh aspect.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic arrangement illustrating an exposure apparatusaccording to an embodiment.

FIG. 2 shows a schematic arrangement illustrating magnified parts of theexposure apparatus according to the embodiment.

FIG. 3 shows an arrangement of a liquid-repellent functional filmaccording to the embodiment.

FIG. 4 shows a flow chart illustrating a method for producing amicrodevice according to an embodiment.

FIG. 5 shows a flow chart illustrating a method for producing amicrodevice according to an embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

An exposure apparatus according to an embodiment of the presentinvention will be explained below with reference to the drawings. Asshown in FIG. 1, the exposure apparatus 11 of the embodiment of thepresent invention transfers a circuit pattern formed on a reticle R torespective shot areas on a wafer W via a projection optical system PLwhile synchronously moving the reticle R as a mask and the wafer W as asubstrate in one-dimensional direction (left and right directions in theplane of the paper of FIG. 1 in this embodiment). That is, the exposureapparatus 11 of this embodiment is a scanning type exposure apparatusbased on the step-and-scan manner, i.e., a so-called scanning stepper.In this specification, the term “substrate” includes those obtained bycoating a base material such as a semiconductor wafer with various typesof films including, for example, a protective film (top coat film) and aphotosensitive material (photoresist).

The exposure apparatus 11 is provided with, for example, an exposurelight source (not shown), an illumination optical system 12, a reticlestage RST, the projection optical system PL, a wafer stage WST, and thelike. The reticle stage RST retains the reticle R, and the wafer stageWST retains the wafer W. A light source, which emits the ArF excimerlaser beam (wavelength: 193 nm) as the exposure light beam EL, is usedfor the exposure light source of this embodiment.

The illumination optical system 12 is constructed to include, forexample, an optical integrator such as an unillustrated fly's eye lensand a rod lens, various lens systems such as a relay lens and acondenser lens, an aperture diaphragm, and the like. The exposure lightbeam EL, which is emitted or radiated from the unillustrated exposurelight source, is adjusted so that the exposure light beam EL is allowedto pass through the illumination optical system 12 to thereby irradiatethe pattern on the reticle R uniformly.

The reticle stage RST is arranged between the illumination opticalsystem 12 and the projection optical system PL so that the surface, onwhich the reticle R is to be placed, is substantially perpendicular tothe optical path. That is, the reticle stage RST is arranged on the sideof the object plane of the projection optical system PL (light-incomingside for the exposure light beam EL, i.e., on the upper side as shown inFIG. 1).

The projection optical system PL includes a plurality of lens elementsLS1, LS2, LS3, LS4, LS5, LS6, LS7 (only seven lens elements are shown inFIG. 1). Hereinafter, the lens element LS7 disposed on the side nearestto the wafer W among the respective lens elements LS1 to LS7 is referredto as “first specified lens element”. The lens elements LS1 to LS6except for the lens element LS7 are retained in a barrel 13. The spacesbetween the respective lens elements LS1 to LS6 disposed in the barrel13 are filled with the purge gas (for example, nitrogen). A lens holder14, which is provided to hold the first specified lens element (firstspecified optical element) LS7, is arranged at the lower end of thebarrel 13. Each of the lens elements LS1 to LS7 has a light-incomingsurface into which the exposure light beam EL is allowed to come, and alight-outgoing surface from which the incident exposure light beam EL isallowed to outgo. The respective lens elements LS1 to LS7 are arrangedso that the optical axes (O) are substantially coincident with eachother and the optical path space is formed on a side of thelight-incoming surface and a side of the light-outgoing surface of eachof them.

The wafer stage WST is arranged so that the placing surface for thewafer W is substantially perpendicular to the optical path for theexposure light beam EL on the image plane side of the projection opticalsystem PL. The image of the pattern on the reticle R illuminated withthe exposure light beam EL is projected and transferred onto the wafer Wdisposed on the wafer stage WST in a state of being reduced by apredetermined reduction magnification via the projection optical systemPL.

In this arrangement, the exposure apparatus 11 of this embodiment is aliquid immersion exposure apparatus to which the liquid immersion methodis applied in order that the wavelength of the exposure light beam EL issubstantially shortened to improve the resolution and the depth of focusis substantially widened. Therefore, the exposure apparatus 11 isprovided with a liquid immersion mechanism. The liquid immersionmechanism is provided with a liquid supply system including a firstliquid supply unit 17 and a second liquid supply unit 18 forindividually supplying the pure water LQ to an optical path space 15disposed on the side of the light-outgoing surface of the firstspecified lens element LS7 and an optical path space 16 disposed on theside of the light-outgoing surface. The liquid immersion mechanism isprovided with a first liquid recovery unit 19 and a second liquidrecovery unit 20 for individually recovering the pure water LQ suppliedto the optical path space 15 and the optical path space 16.

As shown in FIG. 2, a liquid immersion area LT1 is formed in the opticalpath space 15 between the first specified lens element LS7 and the waferW by supplying the pure water LQ from the first liquid supply unit 17.The pure water LQ, which forms the liquid immersion area LT1, isrecovered from the optical path space 15 on the basis of the driving ofthe first liquid recovery unit 19. A liquid immersion area LT2 is formedin the optical path space 16 between the first specified lens elementLS7 and the lens element (second specified optical element) LS6 arrangedon a side of the object plane of the projection optical system PL withrespect to the first specified lens element LS7 by supplying the purewater LQ from the second liquid supply unit 18. That is, the lenselement LS6 is constructed as the second specified lens element which isdisposed most closely to the image plane of the projection opticalsystem PL next to the first specified lens element LS7. The pure waterLQ, which forms the liquid immersion area LT2, is recovered from theoptical path space 16 on the basis of the driving of the second liquidrecovery unit 20.

In this arrangement, the second specified lens element LS6 is an opticalelement having a refractive power (lens function). The second specifiedlens element LS6 has a lower surface LS6 c which has a shape of flatsurface, and an upper surface LS6 b which is formed to be convex towardthe object plane of the projection optical system PL to provide thepositive refractive power. The second specified lens element LS6 has asubstantially circular shape as viewed in an upper plan view. The outerdiameter of the upper surface LS6 b is formed to be larger than theouter diameter of the lower surface LS6 c. That is, the second specifiedlens element LS6 has its central portion which is an exposure light beampassage portion (effective area) LS6A for allowing the exposure lightbeam EL to pass therethrough. Further, a flange portion LS6B is formedon a side of the outer circumference of the exposure light beam passageportion LS6A. The second specified lens element LS6 is supported by thebarrel 13 by the aid of the flange portion LS6B. In this specification,the “effective area” of the optical element is the area in which thelight other than any unnecessary light such as the flare light and thestray light is planned to be radiated onto the optical element orallowed to outgo therefrom, which is the area established upon theoptical design. For example, when the concerning optical element isincorporated in an imaging optical system such as the projection opticalsystem, the effective area is defined as follows. That is, the effectivearea of the optical plane is the area occupied on the optical plane bythe light flux allowed to arrive at the optical plane of the opticalelement (subjected to the backward ray trace) when the light flux havingthe maximum numerical aperture is subjected to the backward ray tracefrom all image points in the image field as the area practicallysubjected to the aberration correction on the image plane of the imagingoptical system. When the optical element is provided with a plurality ofoptical planes, the respective effective areas are the effective areasof the optical element (optical element includes a plurality ofeffective areas).

The first specified lens element LS7 is a plane-parallel plate having norefractive power through which the exposure light beam EL istransmissive. The lower surface LS7 c and the upper surface LS7 b areparallel to one another. The first specified lens element LS7 has asubstantially circular shape as viewed in an upper plan view. The outerdiameter of the upper surface LS7 b is formed to be larger than theouter diameter of the lower surface LS7 c. That is, the central portionof the first specified lens element LS7 is the exposure light beampassage portion (effective area) LS7A for allowing the exposure lightbeam EL to pass therethrough. Further, the flange portion LS7B is formedon a side of the outer circumference of the exposure light beam passageportion LS7A. The first specified lens element LS7 is supported by thelens holder 14 by the aid of the flange portion LS7B.

An annular nozzle member 21 (hereinafter referred to as “second nozzlemember” because the nozzle member supplies the pure water LQ to thesecond optical path space 16 as counted from the side of the wafer W) isarranged to surround the optical path for the exposure light beam ELbetween the barrel 13 and the lens holder 14 in the projection opticalsystem PL of the embodiment of the present invention. The second nozzlemember 21 is fixed to the lower end of the barrel 13 by means of screws(not shown). The lens holder 14 is fixed to the lower surface side ofthe second nozzle member 21 by means of a plurality of screws SC (onlytwo screws are shown in FIG. 2).

As shown in FIG. 2, the second nozzle member 21 is arranged such thatthe inner side surface 21 b is opposed to the side surface LS6 adisposed between the lower surface LS6 c and the lower surface LS6 d ofthe second specified lens element LS6, and the upper surface 21 c isopposed to the lower surface LS6 d of the second specified lens elementLS6. An annular projection 21 d is formed on the upper surface 21 c ofthe second nozzle member 21. An extremely narrow gap is formed by theprojection 21 d between the upper surface of the projection 21 d and thelower surface LS6 d of the second specified lens element LS6. That is,the second nozzle member 21 is arranged to make no contact with thesecond specified lens element LS6 by forming the gap between the innerside surface 21 b and the side surface LS6 a of the second specifiedlens element LS6 and between the upper surface of the projection 21 d ofthe second nozzle member 21 and the lower surface LS6 d of the secondspecified lens element LS6.

A water-repellent functional film 28, which serves as a liquid-repellentfunctional film, is formed on the side surface LS6 a of the secondspecified lens element LS6 and the lower surface LS6 d of the flangeportion LS6B, i.e., on the surface portion disposed outside theeffective area of the second specified lens element LS6, i.e., in thearea which does not intersect the optical axis (O) of the secondspecified lens element LS6. As shown in FIG. 3, the water-repellentfunctional film 28 is composed of a light-shielding film 28 a which isformed on the surface of the lower surface LS6 d and the side surfaceLS6 a of the second specified lens element LS6, and a water-repellentfilm 28 b which is the liquid-repellent film formed on the surface ofthe light-shielding film 28 a. In this arrangement, the water-repellentfilm 28 b, which constitutes the water-repellent functional film 28, isformed of a fluororesin material capable of effecting the film formationat a low temperature, a fluorine-based resin material such aspolytetrafluoroethylene, an acrylic resin material, or a silicon-basedresin material. CYTOP (manufactured by ASAHI GLASS CO., LTD.) may beused as the water-repellent film. The light-shielding film 28 a, whichconstitutes the water-repellent functional film 28, is one of a metalfilm and a metal oxide film having an optical density OD of not lessthan 1. Specifically, the metal film may be a film formed of at leastone metal selected from the group consisting of Au, Pt, Ag, Ni, Ta, W,Pd, Mo, Ti, Si, and Cr. Specifically, the metal oxide film may be a filmformed of at least one substance selected from the group consisting ofZrO₂, HfO₂, TiO₂, Ta₂O₅, SiO, and Cr₂O₃. That is, it is allowable to usea single substance selected from the oxide group. Alternatively, it isallowable to use any mixture thereof as well.

Examples of the combination of the water-repellent film/light-shieldingfilm (material and film thickness) include fluororesin; 1.0 μm/Si: 200nm, fluororesin: 1.0 μm/Ta: 200 nm, fluororesin 0.5 μm/Cr₂O₃: 50 nm/Cr:150 nm, fluororesin: 0.5 μm/W: 100 nm/Cr: 100 nm, and the like. In anyone of these combinations, it is possible to provide OD of not less than1.

An explanation will be made below about a method for providing theliquid-repellent functional film 28 on the second specified lens elementLS6. At first, the light-shielding film 28 a is formed outside theeffective area on the surface of the optical element LS6. When one ofthe metal film and the metal oxide film is formed as the light-shieldingfilm 28 a, it is possible to use the dry film formation methodincluding, for example, the vacuum vapor deposition method, the ion beamassisted vapor deposition method, the gas cluster ion beam assistedvapor deposition method, the ion plating method, the ion beam sputteringmethod, the magnetron sputtering method, the bias sputtering method, andthe radio frequency sputtering method. It is preferable that the filmthickness is adjusted by means of the film formation time and the filmformation condition including, for example, film formation rater and theoptical density OD is made not less than 1 by means of the absorptionand the reflection of the film obtained thereby. The light-shieldingfilm 28 a may typically have a thickness of 100 nm to 300 nm. Thoseusable to provide the film outside the effective area on the surfaceinclude, for example, the mask method in which the effective area of theoptical element LS6 is previously masked with a seal or the like to formthe film, and the method in which a shielding member is provided in theapparatus such as the vapor deposition apparatus to prevent anydeposited matter in the effective area.

Subsequently, an explanation will be made about a method for forming thewater-repellent film 28 b on the light-shielding film. Those usable asthe method for forming the film in the wet state include, for example,the spin coat method and the dip coat method. In this procedure, thefilm having the appropriate liquid-repellent function can be formed byadjusting, for example, the concentration of the resin solution and thenumber of revolutions and the pull-up speed when the coating isperformed. The water-repellent film 28 b may typically have a thicknessof 0.1 to 2.0 μm. In the present invention, it is affirmed that thesufficient liquid-repellent function is provided on condition that thecontact angle is not less than 90 degrees with respect to the liquid tobe used, for example, for the liquid immersion exposure. The durabilitymay be improved by improving the strength of the film by effecting theheating after the coating of the liquid-repellent film in accordancewith the method as described above.

The water-repellent functional film 28 has the light-shielding film 28 awhich is formed on the surface of the second specified lens element LS6.Therefore, it is possible to avoid the radiation of the light onto thewater-repellent film 28 b, the light resulting from the laser beam orthe like as the exposure light beam EL The water-repellent film 28 b isformed outside the effective area of the second specified lens elementLS6. Therefore, the exposure light beam EL is not radiated thereondirectly. However, any unintended reflected light beam or any straylight is radiated onto the water-repellent film 28 b in some situations.The optical deterioration of the water-repellent film 28 b can beavoided by the light-shielding film 28 a. In particular, in order toprevent the stray light from coming into the water-repellent film 28 bafter passing through the second specified lens element LS6, it isnecessary that the light-shielding film 28 a is provided between thewater-repellent film 28 b and the light-outgoing surface of the secondspecified lens element LS6. When the metal film is used for thelight-shielding film 28 a, it is possible to suppress the energyabsorption by the light-shielding film 28 a, because the metal film isthe reflective film. It is possible to avoid the deterioration of theoptical characteristics of the second specified lens element LS6 whichwould be otherwise caused by the increase in the temperature of thelight-shielding film 28 a. When the metal oxide film is used for thelight-shielding film 28 a, it is possible to avoid the stray light whichwould be caused by the reflection from the light-shielding film 28 a,because the metal oxide film is the absorptive film.

The second nozzle member 21 is connected to the second liquid supplyunit 18 via a liquid supply tube 22. A liquid supply passage 23, whichis communicated with the liquid supply tube 22, is formed in the secondnozzle member 21. The pure water LQ, which is allowed to flow throughthe liquid supply tube 22 and the liquid supply passage 23, is allowedto flow into the optical path space 16 via a supply opening 24 which isformed on the side of the inner side surface 21 b of the second nozzlemember 21. The second nozzle member 21 is connected to the second liquidrecovery unit 20 via a liquid recovery tube 25. A liquid recoverypassage 26, which is communicated with the liquid recovery tube 25, isformed in the second nozzle member 21. The pure water LQ, which issupplied to the liquid immersion area LT2 in the optical path space 16,is recovered by the second liquid recovery unit 20 via a recoveryopening 27 which is formed on the side opposed to the supply opening 24on the side of the inner side surface 21 b of the second nozzle member21. The recovery opening 27 is formed on the side of the object plane(upper position as shown in FIG. 2) as compared with the liquidimmersion area LT2.

An annular nozzle member 30 (hereinafter referred to as “first nozzlemember” because it supplies the pure water LQ to the first optical pathspace 15 as counted from the side of the wafer W) is arranged tosurround the optical path for the exposure light beam EL between thelens holder 14 and the wafer W. The first nozzle member 30 is supportedby an unillustrated support member to make no abutment against the firstspecified lens element LS7 and the lens holder 14.

The first nozzle member 30 is arranged so that the inner side surface 30b is opposed to the side surface LS7 a disposed between the lowersurface LS7 c and the lower surface LS7 d of the first specified lenselement LS7, and the upper surface 30 c is opposed to the lower surfaceLS7 d of the flange portion LS7B of the first specified lens elementLS7. The first nozzle member 30 is arranged to make no contact with thefirst specified lens element LS7 by forming the gap between the innerside surface 30 b and the side surface LS7 a of the first specified lenselement LS7.

In this embodiment, there are provided a stepped shape 50 which is acircumferential boundary shape provided along the circumferential edgeportion LS7 e of the upper surface of the first specified lens elementLS7, i.e., the edge of the first specified lens element LS7 outside theeffective area on the side of the light-incoming surface of the firstspecified lens element LS7, and a water-repellent film 51 which iscomposed of a fluororesin capable of being formed into the film at a lowtemperature and which is provided on the surface of the first specifiedlens element LS7 outside the circumferential stepped shape 50. Awater-repellent film or a light-shielding film and a water-repellentfilm may be provided outside the effective area of the first specifiedlens element LS7 (for example, on the side surface LS7 a).

The first nozzle member 30 is connected to the first liquid supply unit17 via a liquid supply tube 31. A liquid supply passage 32, which iscommunicated with the liquid supply tube 31, is formed in the firstnozzle member 30. Further, a supply opening 33, which is communicatedwith the liquid supply passage 32, is formed in an annular form on thelower surface side of the first nozzle member 30. The first nozzlemember 30 is connected to the first liquid recovery unit 19 via a liquidrecovery tube 34. A liquid recovery passage 35, which is communicatedwith the liquid recovery tube 34, is formed in the first nozzle member30. Further, a recovery opening 36, which is communicated with theliquid recovery passage 35, is formed in an annular form on the lowersurface side of the first nozzle member 30. The recovery opening 36 isformed to surround the supply opening 33 outside the supply opening 33.A porous member 37, which is formed with a large number of holes orpores, is provided for the recovery opening 36.

Next, an explanation will be made about the function to be obtained whenthe pure water LQ is supplied to the respective optical path spaces 15,16 of the exposure apparatus 11 of the embodiment of the presentinvention. When the wafer W, which is placed on the wafer stage WST, isarranged on the optical path for the exposure light beam EL, the firstliquid supply unit 17 and the second liquid supply unit 18 start thedriving. Accordingly, the pure water LQ is supplied from the firstliquid supply unit 17. The pure water LQ is allowed to flow through theliquid supply tube 31 and the liquid supply passage 32, and the purewater LQ is supplied via the supply opening 33 into the optical pathspace 15. Simultaneously, the pure water LQ is supplied from the secondliquid supply unit 18. The pure water LQ is allowed to flow through theliquid supply tube 22 and the liquid supply passage 23, and the purewater LQ is supplied via the supply opening 24 into the optical pathspace 16.

When a predetermined amount of the pure water LQ is supplied into theoptical path space 15, the driving of the first liquid supply unit 17 isstopped. As a result, the liquid immersion area LT1, which is composedof the pure water LQ, is formed in the optical path space 15. When apredetermined amount of the pure water LQ is supplied, the driving ofthe second liquid supply unit 18 is stopped. As a result, the liquidimmersion area LT2, which is composed of the pure water LQ, is formed inthe optical path space 16.

During this process, a part of the pure water LQ disposed in the opticalpath space 16 makes inflow into the gap between the second specifiedlens element LS6 and the second nozzle member 21. However, thewater-repellent functional film 28 is formed on the surface of thesecond specified lens element LS6. Therefore, the inflow of the purewater LQ into the optical path space disposed thereover is avoided owingto the water-repelling effect of the water-repellent functional film 28.If the pure water LQ makes inflow into the optical path space disposedthereover due to the absence of the formation of the water-repellentfunctional film 28 on the surface of the second specified lens elementLS6, it is feared that the pure water LQ may be permeated into theoptical thin film formed on the upper surface LS6 b formed to have theconvex shape toward the object plane of the second specified lenselement LS6, and the optical characteristics of the optical thin filmmay be deteriorated. Further, the optical thin film may be dissolved bythe pure water LQ, and it is impossible to maintain the desired opticalperformance. Accordingly, the water-repellent functional film 28 isrequired in order to avoid the inflow of the pure water LQ into theoptical path space disposed over the second specified lens element LS6.

When the exposure apparatus according to the embodiment described aboveis used, a microdevice (for example, semiconductor element, image pickupelement, liquid crystal display element, and thin film magnetic head)can be produced such that the mask (reticle) R is illuminated by usingthe illumination optical unit (illumination step), and the transferpattern formed on the mask R is transferred to the substrate (wafer) Wby using the projection optical system PL (transfer step). Anexplanation will be made below with reference to a flow chart shown inFIG. 4 about an example of the technique adopted when a semiconductordevice is obtained as the microdevice by forming a predetermined circuitpattern, for example, on a wafer W as the substrate by using theexposure apparatus according to the embodiment described above.

At first, in Step S301 shown in FIG. 4, the metal film isvapor-deposited on 1 lot of wafer W. Subsequently, in Step 5302, themetal film on 1 lot of wafer W is coated with the photoresist. Afterthat, in Step S303, the image of the pattern on the mask R issuccessively transferred by the exposure to the respective shot areas on1 lot of the wafer W via the projection optical system PL by using theexposure apparatus according to the embodiment described above. Afterthat, in Step S304, the photoresist on 1 lot of the wafer W isdeveloped. Subsequently, in Step S305, the etching is performed by usingthe mask of the resist pattern on 1 lot of the wafer W. Accordingly, thecircuit pattern corresponding to the pattern on the mask R is formed onthe respective shot areas on the respective wafers W.

After that, for example, the circuit pattern of the upper layer isformed, and thus the microdevice such as the semiconductor element isproduced. According to the method for producing the semiconductor deviceas described above, the wafer can be satisfactorily exposed with thefine pattern, because the exposure apparatus according to the embodimentdescribed above is used. In Step S301 to Step S305, the metal isvapor-deposited on the wafer W, and the metal film is coated with theresist to perform the respective steps of the exposure, the development,and the etching. However, it goes without saying that the oxide film ofsilicon may be formed on the wafer W prior to these steps, and then theoxide film of silicon may be coated with the resist to perform therespective steps of the exposure, the development, and the etching.

In the case of the exposure apparatus according to the embodimentdescribed above, a liquid crystal display element as the microdevice canbe also obtained by forming a predetermined pattern (for example, acircuit pattern and an electrode pattern) on a plate (glass substrate).An explanation will be made below about an example of the techniqueadopted for this procedure with reference to a flow chart shown in FIG.5. With reference to FIG. 5, in a pattern-forming step S401, theso-called photolithography step is executed, in which the pattern on themask R is transferred to the substrate (for example, a glass substratecoated with the resist) to perform the exposure by using the exposureapparatus according to the embodiment described above. The predeterminedpattern including, for example, a large number of electrodes is formedon the substrate by means of the photolithography step. After that, theexposed substrate is subjected to the respective steps including, forexample, the development step, the etching step, and the resistexfoliation step. Accordingly, the predetermined pattern is formed onthe substrate. The process proceeds to the next color filter-formingstep S402.

Subsequently, in the color filter-forming step S402, a color filter isformed, in which a large number of sets of three types of dotscorresponding to R (Red), G (Green), B (Blue) are arranged in a matrixform, or a plurality of sets of filters of three types of stripes of R,G, B are arranged in the horizontal scanning line direction. Acell-assembling step S403 is executed after the color filter-formingstep S402. In the cell-assembling step 403, the liquid crystal panel(liquid crystal cell) is assembled by using, for example, the substratehaving the predetermined pattern obtained in the pattern-forming stepS401 and the color filter obtained in the color filter-forming stepS402. In the cell-assembling step S403, for example, the liquid crystalis injected into the space between the substrate having thepredetermined pattern obtained in the pattern-forming step S401 and thecolor filter obtained in the color filter-forming step S402 to producethe liquid crystal panel (liquid crystal cell).

After that, in a module-assembling step S404, respective partsincluding, for example, a backlight and an electric circuit forperforming the display operation of the assembled liquid crystal panel(liquid crystal cell) are attached to complete the liquid crystaldisplay element. According to the method for producing the liquidcrystal display element as described above, the wafer can besatisfactorily exposed with the fine pattern, because the exposureapparatus according to the embodiment described above is used.

In the embodiment described above, the first specified lens element LS7and the second specified lens element LS6 may be formed integrally, theliquid immersion area may be formed in only the space disposed on thelight-outgoing surface side of the optical element which is integrallyformed, and the water-repellent functional film may be provided on atleast a part of the surface disposed outside the effective area of theoptical element which is integrally formed.

In the embodiment described above, the explanation has been made asexemplified by the structure in which only the light-shielding film andthe liquid-repellent film (water-repellent film) are provided on thebase material (lens element) of the optical element. However, there isno limitation thereto. The optical element of the present invention maybe provided with another film disposed between the light-shielding filmand the liquid-repellent film and/or between the base material and thelight-shielding film, for example, another functional film including,for example, a protective layer, a layer to improve the tight contactperformance between the light-shielding film and the liquid-repellentfilm, and a layer to reinforce the mechanical strength. Theliquid-repellent film is present at an uppermost layer of theliquid-repellent functional layer in view of the function thereof.

In the embodiment described above, the light-shielding film and theliquid-repellent film are formed on the base material (lens element) ofthe optical element. However, there is no limitation to the form of thefilm. It is possible to provide a light-shielding member and aliquid-repellent member having various forms. For example, it is alsoallowable to provide a frame-shaped formed member to cover the outerportion of the lens element (outside the effective area). Such a formedmember may be composed of an integrated unit formed with thelight-shielding substance and the liquid-repellent substance asdescribed above. Alternatively, a member made of the light-shieldingsubstance and a member made of the liquid-repellent substance may beoverlapped and used. There is no limitation to the light-shieldingmember. It is possible to use any light-reducing member for reducing ordimming the incident light allowed to come into the liquid-repellentmember.

In the embodiment described above, the light-shielding film and theliquid-repellent film are formed outside the effective area of the lenselement. However, it is unnecessary to form the light-shielding film andthe liquid-repellent film in all of the area except for the effectivearea. The light-shielding film and the liquid-repellent film may beformed in a part of the area. For example, the light-shielding film andthe liquid-repellent film may be formed in only an annular area disposedclosely to the outermost circumference of the lens element in radialoutside area of the effective area of the lens element.

The embodiment described above is illustrative of the case in which theinclination (side surface LS6 a) is provided at the outercircumferential portion of the light-outgoing surface of the lenselement. However, the light-outgoing surface may be a flat surface, andthe light-shielding film and the liquid-repellent film may be formed inan outer circumferential area of the flat surface (area which is notused as the effective area).

The light-shielding film and the liquid-repellent film may be providedon the side surface other than the light-outgoing surface of the lenselement. In the embodiment described above, the light-shielding film andthe liquid-repellent film are formed on the side surface provided forthe light-outgoing surface. However, the light-shielding film and theliquid-repellent film may be formed on the side surface between theupper surface (light-incoming surface) and the lower surface(light-outgoing surface) of the lens element. In the case of the lenselement having a hemispherical shape (constructed by a flat surface anda curved surface), the light-shielding film and the liquid-repellentfilm may be provided on the outer circumferential portion of the curvedsurface.

In the embodiment described above, the light-shielding film and theliquid-repellent film are applied to the second lens element of theprojection optical system PL as the optical element. However, there isno limitation thereto. It is also possible to make the application toanother lens element of the projection optical system having a certainpossibility to make contact with the liquid. The optical element, whichis provided with the light-shielding film and the liquid-repellent filmaccording to the present invention, is not limited to the lens elementof the projection optical system PL. The present invention is applicableto any optical element including, for example, lenses andlight-transmissive plates provided for the alignment optical system andvarious sensors provided for the substrate stage (or the measuring stageas described later on). For example, as disclosed in InternationalPublication No. 2006/64900, the present invention is also applicable toan exposure apparatus in which a photosensitive substrate is exposedwith a pattern by using a plurality of diffraction gratings. Inparticular, the light-shielding film and the liquid-repellent film asexplained in the embodiment described above may be provided on at leastone of light-transmissive flat plates P1, P2 formed with diffractiongratings as shown in FIGS. 18 and 19 of International Publication No.2006/64900.

In the embodiment described above, it is also allowable to use, forexample, the KrF excimer laser (248 nm), the Kr₂ laser (146 nm), and theAr₂ laser (126 nm) in addition to the F₂ laser (157 nm) as the exposurelight source.

In the embodiment described above, the liquid may be those other thanthe pure water LQ. For example, when the exposure light source is the F₂laser, it is desirable to use a fluorine-based liquid such asfluorine-based oil and perfluoropolyether (PFPE), because the F₂ laserbeam is not transmissive through the pure water LQ. In this case, it isrequired to provide a functional film which is repellent against thefluorine-based liquid. It is necessary to provide a liquid-repellentfunctional film composed of a substance having a high contact angle withrespect to the liquid to be used. One or a plurality of optical elementsincluded in the optical elements for constructing the illuminationoptical system 12 or the projection optical system PL may be constructedto have the liquid-repellent functional film having the light-shieldingfilm and the liquid-repellent film on the surface outside the effectivearea of the exposure light beam EL.

The embodiment described above has been explained as exemplified by theexposure apparatus having the single substrate stage by way of example.However, the optical system and the optical element of the presentinvention may be applied to a multi-stage (twin-stage) type exposureapparatus in which two substrate stages are moved between an exposurestation and a measuring station. Such a multi-stage type exposureapparatus is disclosed in U.S. Pat. Nos. 6,341,007, 6,400,441,6,549,269, 6,590,634, and 5,969,441. These United States Patentdocuments are incorporated herein by reference.

Further, for example, as disclosed in International Publication No.1999/23692 and U.S. Pat. No. 6,897,963, the present invention is alsoapplicable to an exposure apparatus provided with a substrate stagewhich retains a substrate and a measuring stage which carries a fiducialmember formed with a fiducial mark and/or various photoelectric sensors.U.S. Pat. No. 6,897,963 is incorporated herein by reference.

In the embodiment described above, the exposure apparatus is adopted, inwhich the space between the projection optical system PL and thesubstrate P is locally filled with the liquid. However, the presentinvention is also applicable to a liquid immersion exposure apparatus inwhich the exposure is performed in such a state that the entire surfaceof a substrate as an exposure objective is immersed in the liquid, asdisclosed, for example, in Japanese Patent Application Laid-open Nos.6-124873 and 10-303114 and U.S. Pat. No. 5,825,043.

The embodiment described above has been explained as exemplified by thecase of the exposure apparatus provided with the projection opticalsystem PL by way of example. However, the present invention isapplicable to an exposure apparatus and an exposure method in which theprojection optical system PL is not used. Even when the projectionoptical system PL is not used as described above, then the exposurelight beam is radiated onto the substrate via an optical member such asa lens or a diffractive optical element, and the liquid immersion areais formed in a predetermined space between the substrate and the opticalmember as described above.

The present invention is also applicable, for example, to an exposureapparatus in which a substrate is exposed with a line-and-space patternby forming interference fringes on the substrate as disclosed, forexample, in International Publication No. 2001/035168, and an exposureapparatus in which two mask patterns are combined on a substrate via aprojection optical system, and one shot area on the substrate issubjected to the double exposure substantially simultaneously by meansof one time scanning exposure as disclosed, for example, in JapanesePatent Application Laid-open No. 2004-519850 (PCT) (corresponding toU.S. Pat. No. 6,611,316).

The disclosures of all of the Japanese laid-open patent documents andUnited States Patent documents in relation to, for example, the exposureapparatus cited in the respective embodiments and the modifiedembodiments are incorporated herein by reference within a range ofpermission of the domestic laws and ordinances of the state designatedor selected in this international application.

As for the type of the exposure apparatus, the present invention is notlimited to the exposure apparatus for producing the microdevice such asthe semiconductor element for exposing the substrate P with thesemiconductor element pattern. The present invention is also widelyapplicable, for example, to the exposure apparatus for producing theliquid crystal display element or for producing the display as well asthe exposure apparatus for producing the thin film magnetic head, theimage pickup device (CCD), the micromachine, MEMS, and the DNA chip.

The present invention is also applicable to an exposure apparatus fortransferring a circuit pattern from a mother reticle to a glasssubstrate or a silicon wafer in order to produce a reticle or a mask tobe used, for example, for the light exposure apparatus, the EUV exposureapparatus, the X-ray exposure apparatus, and the electron beam exposureapparatus. In general, the transmissive type reticle is used for theexposure apparatus which uses DUV (deep ultraviolet) light or VUV(vacuum ultraviolet) light. Those usable as the reticle substrateinclude, for example, silica glass, fluorine doped silica glass, calciumfluoride, magnesium fluoride, and quartz crystal. In the case of theelectron beam exposure apparatus and the X-ray exposure apparatus basedon the proximity manner, the transmissive type mask (stencil mask,membrane mask) is used. For example, a silicon wafer is used as the masksubstrate.

In the embodiment described above, the light-transmissive type mask isused, in which the predetermined light-shielding pattern (or the phasepattern or the light-reducing pattern) is formed on thelight-transmissive base material. However, in place of this mask, it isalso allowable to use an electronic mask (also referred to as “variableshaped beam mask” including, for example, DMD (Digital Micro-mirrorDevice) as one of non-light emission type image display element (spatialoptical modulator)) for forming a transmissive pattern, a reflectivepattern, or a light emission pattern on the basis of electronic data ofa pattern to be formed on a substrate as an exposure objective asdisclosed, for example, in U.S. Pat. No. 6,778,257.

The exposure apparatus according to the embodiment of the presentinvention is produced by assembling the various subsystems including therespective constitutive elements as defined in claims so that thepredetermined mechanical accuracy, the electric accuracy, and theoptical accuracy are maintained. In order to secure the variousaccuracies, those performed before and after the assembling include theadjustment for achieving the optical accuracy for the various opticalsystems, the adjustment for achieving the mechanical accuracy for thevarious mechanical systems, and the adjustment for achieving theelectric accuracy for the various electric systems. The steps ofassembling the various subsystems into the exposure apparatus include,for example, the mechanical connection, the wiring connection of theelectric circuits, and the piping connection of the air pressurecircuits in correlation with the various subsystems. It goes withoutsaying that the steps of assembling the respective individual subsystemsare performed before performing the steps of assembling the varioussubsystems into the exposure apparatus. When the steps of assembling thevarious subsystems into the exposure apparatus are completed, theoverall adjustment is performed to secure the various accuracies as theentire exposure apparatus. It is desirable that the exposure apparatusis produced in a clean room in which, for example, the temperature andthe cleanness are managed.

1. An exposure apparatus which radiates an exposure beam onto asubstrate, comprising: an optical element which is irradiated with theexposure beam and of which an optical path space on an outgoing surfaceside of the optical element for the exposure beam is filled with aliquid, wherein: the optical element includes a liquid-repellentfunctional film provided on at least a part of a surface of the opticalelement, which is located outside an effective area of the opticalelement.
 2. The exposure apparatus according to claim 1, wherein theliquid-repellent functional film is a water-repellent functional film.3. The exposure apparatus according to claim 1, wherein theliquid-repellent functional film includes a light-shielding film whichis formed on the surface of the optical element, and a liquid-repellentfilm which is formed on a surface of the light-shielding film.
 4. Theexposure apparatus according to claim 1, further comprising anotheroptical element which is different from the optical element and disposedon a side of the substrate with respect to the optical element.
 5. Theexposure apparatus according to claim 3, wherein the liquid-repellentfilm is composed of a fluororesin.
 6. The exposure apparatus accordingto claim 3, wherein the light-shielding film has an optical density ODof not less than
 1. 7. The exposure apparatus according to claim 3,wherein the light-shielding film is formed with one of a metal film anda metal oxide film.
 8. The exposure apparatus according to claim 7,wherein the metal film is formed of at least one metal selected from thegroup consisting of Au, Pt, Ag, Ni, Ta, W, Pd, Mo, Ti, Si, and Cr. 9.The exposure apparatus according to claim 7, wherein the metal oxidefilm is formed of at least one substance selected from the groupconsisting of ZrO₂, HfO₂, TiO₂, Ta₂O₅, SiO, and Cr₂O₃.
 10. An exposureapparatus which exposes a pattern formed on a mask on a substrate,comprising: a projection optical system which has a plurality of opticalelements and which projects the pattern onto the substrate in a statethat a liquid immersion area is formed in an optical path space on aside of a light-outgoing surface of an optical element arranged nearestto the substrate among the optical elements; and a light-shielding filmand a liquid-repellent film provided on a part of a surface which islocated outside an effective area of at least one optical element of theplurality of optical elements.
 11. The exposure apparatus according toclaim 10, wherein the liquid-repellent film is formed of a fluororesin.12. The exposure apparatus according to claim 10, wherein thelight-shielding film is formed with one of a metal film and a metaloxide film.
 13. A method for producing a microdevice, comprising: anexposure step for exposing a predetermined pattern on a substrate byusing the exposure apparatus as defined in claim 1; and a developmentstep for developing the substrate exposed in the exposure step.
 14. Amethod for producing a microdevice, comprising: an exposure step forexposing a predetermined pattern on a substrate by using the exposureapparatus as defined in claim 10; and a development step for developingthe substrate exposed in the exposure step.
 15. An optical element whichis used for a liquid immersion exposure apparatus, comprising: a basematerial; a liquid-repellent member which is provided to cover at leasta part of the base material; and a light-reducing member which isprovided between the base material and the liquid-repellent member. 16.The optical element according to claim 15, wherein the light-reducingmember reduces light to protect the liquid-repellent member from lightirradiation, and the light-reducing member is provided outside aneffective area of the optical element.
 17. The optical element accordingto claim 15, wherein the light-reducing member reduces light to protectthe liquid-repellent member from light irradiation, and thelight-reducing member is provided on a side surface of the opticalelement.
 18. The optical element according to claim 15, wherein thelight-reducing member reduces light to protect the liquid-repellentmember from light irradiation, and the light-reducing member is providedin an area which does not intersect an optical axis of the opticalelement.
 19. The optical element according to claim 15, wherein theoptical element makes contact with a liquid.
 20. The optical elementaccording to claim 19, wherein a light-outgoing surface of the opticalelement makes contact with the liquid.
 21. The optical element accordingto claim 15, wherein at least one of the light-reducing member and theliquid-repellent member is a thin film.
 22. The optical elementaccording to claim 15, wherein the light-reducing member is alight-shielding film.
 23. The optical element according to claim 22,wherein the light-shielding film has an optical density OD of not lessthan
 1. 24. The optical element according to claim 15, wherein thelight-reducing member is formed with one of a metal film and a metaloxide film.
 25. The optical element according to claim 24, wherein themetal film is formed of at least one metal selected from the groupconsisting of Au, Pt, Ag, Ni, Ta, W, Pd, Mo, Ti, Si, and Cr.
 26. Theoptical element according to claim 24, wherein the metal oxide film isformed of at least one selected from the group consisting of ZrO₂, HfO₂,TiO₂, Ta₂O₅, SiO, and Cr₂O₃.
 27. The optical element according to claim15, wherein the liquid-repellent member is a water-repellent film. 28.The optical element according to claim 27, wherein the water-repellentfilm is composed of a fluororesin.
 29. The optical element according toclaim 15, wherein a plurality of film layers, which include alight-reducing film as the light-reducing member and a liquid-repellentfilm of the liquid-repellent member, are provided on a surface of thebase material, and an outermost surface layer of the plurality of layersis the liquid-repellent film.
 30. The optical element according to claim15, wherein the light-reducing member is provided on at least a part ofa surface of the base material, and the liquid-repellent member isprovided on at least a part of a surface of the light-reducing member.31. An optical system which is used for a liquid immersion exposureapparatus, comprising the optical element as defined in claim
 15. 32.The optical-system according to claim 31, wherein an optical path space,which is disposed on a light-outgoing side, is filled with a liquid. 33.The optical system according to claim 31, wherein the optical system isa projection optical system which projects a predetermined pattern ontoa substrate.
 34. A liquid immersion exposure apparatus comprising anoptical element as defined in claim
 15. 35. The liquid immersionexposure apparatus according to claim 34, comprising at least two of theoptical elements as defined in claim
 15. 36. The liquid immersionexposure apparatus according to claim 34, wherein the optical elementmakes contact with a liquid.
 37. The liquid immersion exposure apparatusaccording to claim 36, wherein a light-outgoing surface of the opticalelement makes contact with the liquid.
 38. The liquid immersion exposureapparatus according to claim 34, wherein the light-reducing memberreduces light to protect the liquid-repellent member from lightirradiation, and the light-reducing member is provided outside aneffective area of the optical element.
 39. The liquid immersion exposureapparatus according to claim 34, wherein the light-reducing memberreduces light to protect the liquid-repellent member from lightirradiation, and the light-reducing member is provided on a side surfaceof the optical element.
 40. The liquid immersion exposure apparatusaccording to claim 34, wherein the light-reducing member reduces lightto protect the liquid-repellent member from light irradiation, and thelight-reducing member is provided in an area which does not intersect anoptical axis of the optical element.
 41. The liquid immersion exposureapparatus according to claim 34, wherein at least one of thelight-reducing member and the liquid-repellent member is a thin film.42. The liquid immersion exposure apparatus according to claim 34,wherein the light-reducing member is a light-shielding film.
 43. Theliquid immersion exposure apparatus according to claim 42, wherein thelight-shielding film has an optical density OD of not less than
 1. 44.The liquid immersion exposure apparatus according to claim 42, whereinthe light-shielding film is formed with one of a metal film and a metaloxide film.
 45. The liquid immersion exposure apparatus according toclaim 44, wherein the metal film is formed of at least one metalselected from the group consisting of Au, Pt, Ag, Ni, Ta, W, Pd, Mo, Ti,Si, and Cr.
 46. The liquid immersion exposure apparatus according toclaim 44, wherein the metal oxide film is formed of at least oneselected from the group consisting of ZrO₂, HfO₂, TiO₂, Ta₂O₅, SiO, andCr₂O₃.
 47. The liquid immersion exposure apparatus according to claim41, wherein the liquid-repellent member is a water-repellent film. 48.The liquid immersion exposure apparatus according to claim 47, whereinthe water-repellent film is composed of a fluororesin.
 49. The liquidimmersion exposure apparatus according to claim 34, wherein a pluralityof film layers, which include a light-reducing film as thelight-reducing member and a liquid-repellent film of theliquid-repellent member, are provided on a surface of the base material,and an outermost surface layer of the plurality of layers is theliquid-repellent film.
 50. The liquid immersion exposure apparatusaccording to claim 34, wherein the light-reducing member is provided onat least a part of a surface of the base material, and theliquid-repellent member is provided on at least a part of a surface ofthe light-reducing member.
 51. A liquid immersion exposure methodcomprising: providing a substrate; and exposing the substrate via theoptical element as defined in claim
 15. 52. The liquid immersionexposure method according to claim 51, further comprising supplying aliquid, wherein the optical element makes contact with the suppliedliquid.
 53. The liquid immersion exposure method according to claim 52,wherein the liquid is supplied to a light-outgoing side of the opticalelement.
 54. The liquid immersion exposure method according to claim 53,wherein the substrate is exposed via an optical system which includesthe optical element, and the optical system includes another opticalelement which is different from the optical element and which isdisposed on the light-outgoing side of the optical element.
 55. A methodfor producing a microdevice, comprising: exposing the substrate by meansof the exposure method as defined in claim 51; developing the exposedsubstrate; and processing the developed substrate.
 56. A method forproducing an optical element which is used for a liquid immersionexposure apparatus, the method comprising: providing a liquid-repellentmember to cover at least a part of a base material; and providing alight-reducing member which protects the liquid-repellent member betweenthe base material and the liquid-repellent member.
 57. A method forproducing a liquid immersion exposure apparatus, comprising: providingthe optical element produced by the production method as defined inclaim 56; a step for providing an illumination optical system; a stepfor providing a projection optical system including the optical elementprovided at a predetermined position in a barrel; a step for providing astage for carrying a substrate thereon; a step for providing a liquidsupply system which supplies a liquid to a space between the projectionoptical system and the substrate; and an adjusting step for adjustingarrangement of the illumination optical system, the projection opticalsystem, and the stage so that a light beam, which is emitted from alight source, is transmitted via the illumination optical system and theprojection optical system in this order to arrive at the substrate.